By Clemens C. W. Ruppel
A part of a suite of 14 studies of quite a lot of issues in acoustic wave know-how, geared toward the medical viewers. beneficial properties seven really good papers in all, discussing problems with observed units, from Green's features to instant observed sensor structures.
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Additional info for Advances in surface acoustic wave technology, systems and applications. Vol. 2
61 It is more appropriate to consider Cv as a parameter to be fitted so as to most accurately describe the capacitive contribution to the admittance in Eq. (71) in the frequency range of interest. 6. 2 the components of the P-matrix for a uniform structure were found to depend on the phases of the reflectivity and the transduction coefficient, 8T = LK and 6e = la, respectively. The phases depend on the locations of the reflectivity and transduction centers of the considered period, and they are connected to the directionality of the structure.
The problem of accurate determination of parameters is practically the same for all models. The parameters depend on the geometry and the physical properties of the electrode structure and substrate. Whatever model is used, technological variations result in inaccurate determination of the parameters and in finite precision of the design. 3. I m p r o v e m e n t s a n d Modifications of t h e C O M M o d e l The COM model has been widely applied in the design of devices based on different types of waves, substrate materials, and electrode structures.
On the other hand, in the limit r —>• oo the current vanishes, I —>• 0. e. an array of floating electrodes. The equations reduce to those in Eq. 2 based on charge neutrality considerations. 2. Velocity dispersion, backscattering and bulk-wave generation The accuracy of the COM model is basically limited to a narrow frequency band around the resonance. However, the requirements on SAW filter performance are not limited to the passband of the device, but usually cover a much wider frequency 31 898 V.
Advances in surface acoustic wave technology, systems and applications. Vol. 2 by Clemens C. W. Ruppel